Detailed Product Description
Specifications:
Board layer: 3
Material: FR-4
Minimum board thickness: 0.6mm
Minimum line width: 0.25mm
Minimum line spacing: 0.258mm
Minimum hole diameter: 0.5mm
Surface finishing: OSP / Entek / HAL
Board thickness: 1.6mm
Main export markets: Eastern Europe, Western Europe, North America, Asia
Packing:
Vacuum packing
